Open AccessEffect of Cerium Ammonium Nitrate and Alumina Abrasive Particles on Polishing Behavior in Ruthenium Chemical Mechanical Planarization
Author(s) -
Sangho Lee,
Sungho Lee,
Young-Jae Kang,
InKwon Kim,
Jin-Goo Park
Publication year - 2005
Publication title -
journal of the korean institute of electrical and electronic material engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2005.18.9.803
Subject(s) - abrasive , chemical mechanical planarization , nitric acid , materials science , polishing , etching (microfabrication) , slurry , surface roughness , cerium nitrate , isotropic etching , layer (electronics) , cerium , x ray photoelectron spectroscopy , surface finish , abrasion (mechanical) , chemical engineering , metallurgy , inorganic chemistry , composite material , chemistry , engineering
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