Open AccessAtomic Scale Modeling of Chemical Mechanical Polishing Process
Author(s) -
Ki Ryang Byun,
Jeong Won Kang,
Ki Oh Song,
SungHo Hwang
Publication year - 2005
Publication title -
journal of the korean institute of electrical and electronic material engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2005.18.5.414
Subject(s) - polishing , chemical mechanical planarization , molecular dynamics , materials science , atomic units , abrasive , atomic model , surface (topology) , composite material , chemistry , computational chemistry , physics , geometry , mathematics , atomic physics , quantum mechanics
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