Open AccessA Study of the IMC Growth and Shear Strength of Solder Bump and TiW/Cu/electroplating Cu UBM
Publication year - 2004
Publication title -
journal of the korean institute of electrical and electronic material engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2004.17.3.267
Subject(s) - soldering , intermetallic , materials science , shear strength (soil) , electroplating , metallurgy , isothermal process , composite material , transmission electron microscopy , alloy , layer (electronics) , environmental science , physics , soil science , soil water , nanotechnology , thermodynamics
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