Open AccessA Study of the IMC Growth and Shear Strength of Solder Bump and TiW/Cu/electroplating Cu UBM
Publication year - 2004
Publication title -
jeon'gi jeonja jaeryo haghoe nonmunji/jeon-gi jeonja jaeryo hakoe nonmunji
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2004.17.3.267
Subject(s) - soldering , intermetallic , materials science , shear strength (soil) , electroplating , metallurgy , isothermal process , composite material , transmission electron microscopy , alloy , layer (electronics) , environmental science , physics , soil science , soil water , nanotechnology , thermodynamics