
Bonding Property of Silicon Wafer Pairs with Annealing Method
Publication year - 2003
Publication title -
jeon'gi jeonja jaeryo haghoe nonmunji/jeon-gi jeonja jaeryo hakoe nonmunji
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2003.16.5.365
Subject(s) - wafer , materials science , annealing (glass) , silicon , wafer bonding , property (philosophy) , composite material , optoelectronics , philosophy , epistemology