Open AccessBonding Property of Silicon Wafer Pairs with Annealing Method
Publication year - 2003
Publication title -
journal of the korean institute of electrical and electronic material engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2003.16.5.365
Subject(s) - wafer , materials science , annealing (glass) , silicon , wafer bonding , property (philosophy) , composite material , optoelectronics , philosophy , epistemology
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