Open AccessWafer Level Packaging of RF-MEMS Devices with Vertical feed-through
Publication year - 2003
Publication title -
journal of the korean institute of electrical and electronic material engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2003.16.12s.1237
Subject(s) - wafer , materials science , microelectromechanical systems , wafer level packaging , optoelectronics , silicon , insertion loss , substrate (aquarium) , through silicon via , electronic engineering , electrical engineering , engineering , oceanography , geology
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