Open AccessElectromigration Behavior of Eutectic SnPb Solder
Publication year - 2003
Publication title -
journal of the korean institute of electrical and electronic material engineers
Language(s) - Uncategorized
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2003.16.1.019
Subject(s) - electromigration , materials science , eutectic system , hillock , soldering , microstructure , anode , cathode , metallurgy , current density , composite material , electrical engineering , electrode , chemistry , physics , quantum mechanics , engineering
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