Open AccessEffects of Wafer Cleaning and Heat Treatment in Glass/Silicon Wafer Direct Bonding
Publication year - 2002
Publication title -
journal of the korean institute of electrical and electronic material engineers
Language(s) - English
Resource type - Journals
eISSN - 2288-3258
pISSN - 1226-7945
DOI - 10.4313/jkem.2002.15.6.479
Subject(s) - anodic bonding , wafer , materials science , annealing (glass) , wafer bonding , surface roughness , bonding strength , composite material , analytical chemistry (journal) , silicon , secondary ion mass spectrometry , atomic force microscopy , ion , metallurgy , chemistry , nanotechnology , chromatography , organic chemistry
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