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Gate Optimization Analysis of Injection Molding for Mobile Phone Panel Based on Moldflow and Drop Simulation
Author(s) -
Hongbing Wang,
Chunhua Sun
Publication year - 2021
Publication title -
world journal of engineering and technology
Language(s) - English
Resource type - Journals
eISSN - 2331-4222
pISSN - 2331-4249
DOI - 10.4236/wjet.2021.91007
Subject(s) - workbench , drop (telecommunication) , mobile phone , weld line , drop impact , software , simulation software , molding (decorative) , engineering , welding , mechanical engineering , simulation , structural engineering , computer science , visualization , telecommunications , splash , programming language

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