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Numerical Analysis of Thermal Convection in a CPU Chassis
Author(s) -
M. Z. I. Bangalee,
Md. Mizanur Rahman,
M. Ferdows,
Md. Sirajul Islam
Publication year - 2021
Publication title -
open journal of modelling and simulation
Language(s) - English
Resource type - Journals
eISSN - 2327-4026
pISSN - 2327-4018
DOI - 10.4236/ojmsi.2021.91003
Subject(s) - mechanics , airflow , fin , inlet , turbulence , heat transfer , materials science , heat sink , thermal conduction , mechanical engineering , physics , engineering , composite material

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