
Numerical Analysis of Thermal Convection in a CPU Chassis
Author(s) -
M. Z. I. Bangalee,
Md. Mizanur Rahman,
M. Ferdows,
Md. Sirajul Islam
Publication year - 2021
Publication title -
open journal of modelling and simulation/open journal of modeling and simulation
Language(s) - English
Resource type - Journals
eISSN - 2327-4026
pISSN - 2327-4018
DOI - 10.4236/ojmsi.2021.91003
Subject(s) - mechanics , airflow , fin , inlet , turbulence , heat transfer , materials science , heat sink , thermal conduction , mechanical engineering , physics , engineering , composite material