Open AccessMicrostructure Evolution of W-Cu Alloy Wire
Author(s) -
Fang Shao,
Wenge Chen,
Hui Zhou,
Bingjun Ding
Publication year - 2012
Publication title -
materials sciences and applications
Language(s) - English
Resource type - Journals
eISSN - 2153-1188
pISSN - 2153-117X
DOI - 10.4236/msa.2012.33024
Subject(s) - materials science , microstructure , swaging , alloy , tungsten , metallurgy , copper , ultimate tensile strength , composite material
Microstructure of W-Cu alloy wire before and after hot-swaging was studied in this paper. Results show that a homogeneous microstructure of the W-Cu alloy wire was formed after hot-swaging treatment, and the tungsten particles were embedded in copper phases to form a networking structure; the W-Cu alloy wire has a microstructure of body-centered-cubic tungsten particles and face-centered-cubic copper phase, and did not change after hot-swaging. The intermediate phases have not been found during the process, but the size of the tungsten particles in the copper matrix becomes smaller. After hot-swaging, the treated W-Cu alloy wire has a relative density of 105.1%, and a conductivity of 47.2% IACS, the tensile and bending strength can be as large as 644 and 1600 MPa, respectively