Open AccessInvestigation of Thermal Characterization of a Thermally Enhanced FC-PBGA Assembly
Author(s) -
Chieh-Sheng Lin,
G.H. Wu,
ShenHaw Ju
Publication year - 2013
Publication title -
journal of electronics cooling and thermal control
Language(s) - English
Resource type - Journals
eISSN - 2162-6162
pISSN - 2162-6170
DOI - 10.4236/jectc.2013.33010
Subject(s) - ball grid array , materials science , heat sink , composite material , flip chip , thermal resistance , thermal grease , thermal , electronic packaging , integrated circuit packaging , adhesive , printed circuit board , soldering , thermal analysis , mechanical engineering , thermal conductivity , integrated circuit , optoelectronics , electrical engineering , engineering , layer (electronics) , physics , meteorology
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