Open AccessStudy of Epoxy Bonding
Author(s) -
Xiaohua Zhou,
Zhiyuan Liu,
Hui Xing
Publication year - 2021
Publication title -
journal of computer and communications
Language(s) - Uncategorized
Resource type - Journals
eISSN - 2327-5227
pISSN - 2327-5219
DOI - 10.4236/jcc.2021.96013
Subject(s) - epoxy , adhesive , materials science , adhesive bonding , composite material , epoxy adhesive , surface (topology) , optics , physics , geometry , mathematics , layer (electronics)