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Multi‐stack Technique for a Compact and Wideband EBG Structure in High‐Speed Multilayer Printed Circuit Boards
Author(s) -
Kim Myunghoi
Publication year - 2016
Publication title -
etri journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.295
H-Index - 46
eISSN - 2233-7326
pISSN - 1225-6463
DOI - 10.4218/etrij.16.0115.0997
Subject(s) - stopband , wideband , printed circuit board , planar , metamaterial , stack (abstract data type) , electronic engineering , materials science , ground bounce , power (physics) , noise (video) , port (circuit theory) , engineering , acoustics , optoelectronics , electrical engineering , computer science , physics , band pass filter , voltage , computer graphics (images) , transistor , quantum mechanics , artificial intelligence , gate dielectric , image (mathematics) , programming language
We propose a novel multi‐stack (MS) technique for a compact and wideband electromagnetic bandgap (EBG) structure in high‐speed multilayer printed circuit boards. The proposed MS technique efficiently converts planar EBG arrays into a vertical structure, thus substantially miniaturizing the EBG area and reducing the distance between the noise source and the victim. A dispersion method is presented to examine the effects of the MS technique on the stopband characteristics. Enhanced features of the proposed MS‐EBG structure were experimentally verified using test vehicles. It was experimentally demonstrated that the proposed MS‐EBG structure efficiently suppresses the power/ground noise over a wideband frequency range with a shorter port‐to‐port spacing than the unit‐cell length, thus overcoming a limitation of previous EBG structures.

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