Open AccessNew Thermal‐Aware Voltage Island Formation for 3D Many‐Core Processors
Author(s) -
Hong Hyejeong,
Lim Jaeil,
Lim Hyunyul,
Kang Sungho
Publication year - 2015
Publication title -
etri journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.295
H-Index - 46
eISSN - 2233-7326
pISSN - 1225-6463
DOI - 10.4218/etrij.15.0114.0257
Subject(s) - voltage , many core , multi core processor , thermal , frequency scaling , chip , cpu core voltage , energy consumption , voltage regulator , scheduling (production processes) , scaling , core (optical fiber) , computer science , cluster (spacecraft) , power (physics) , power consumption , parallel computing , electronic engineering , electrical engineering , engineering , voltage optimisation , telecommunications , physics , computer network , operations management , geometry , mathematics , quantum mechanics , meteorology
The power consumption of 3D many‐core processors can be reduced, and the power delivery of such processors can be improved by introducing voltage island (VI) design using on‐chip voltage regulators. With the dramatic growth in the number of cores that are integrated in a processor, however, it is infeasible to adopt per‐core VI design. We propose a 3D many‐core processor architecture that consists of multiple voltage clusters, where each has a set of cores that share an on‐chip voltage regulator. Based on the architecture, the steady state temperature is analyzed so that the thermal characteristic of each voltage cluster is known. In the voltage scaling and task scheduling stages, the thermal characteristics and communication between cores is considered. The consideration of the thermal characteristics enables the proposed VI formation to reduce the total energy consumption, peak temperature, and temperature gradients in 3D many‐core processors.