Open AccessNovel Bumping Material for Solder‐on‐Pad Technology
Author(s) -
Choi KwangSeong,
Chu SunWoo,
Lee JongJin,
Sung KiJun,
Bae HyunCheol,
Lim ByeongOk,
Moon JongTae,
Eom YongSung
Publication year - 2011
Publication title -
etri journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.295
H-Index - 46
eISSN - 2233-7326
pISSN - 1225-6463
DOI - 10.4218/etrij.11.0210.0298
Subject(s) - bumping , soldering , materials science , flip chip , solder paste , substrate (aquarium) , metallurgy , composite material , layer (electronics) , mechanical engineering , adhesive , engineering , oceanography , geology
A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder‐on‐pad technology of the fine‐pitch flip‐chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 µm in one direction.