Open AccessDesign for a Dual‐Frequency Antenna‐in‐Package
Author(s) -
Li Li,
Han Liping,
Han Guorui,
Chen Xinwei,
Geng Yanfeng,
Zhang Wenmei
Publication year - 2010
Publication title -
etri journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.295
H-Index - 46
eISSN - 2233-7326
pISSN - 1225-6463
DOI - 10.4218/etrij.10.0210.0047
Subject(s) - patch antenna , bandwidth (computing) , electronic engineering , microstrip antenna , enhanced data rates for gsm evolution , acoustics , multi band device , electrical engineering , physics , antenna (radio) , engineering , telecommunications
For an antenna‐in‐package (AiP), via holes are used to connect the antenna ground and system ground. In this letter, a dual‐frequency AiP with a U‐slot embedded in the patch is proposed. By properly arranging three via holes under the non‐radiating edge, an AiP with two resonant frequencies is realized. Then a U‐slot is embedded in the patch to further improve the bandwidth of the AiP. To validate the proposed design, an AiP with the bandwidth of 4.49% at 2.45 GHz and 6.02% at 5.32 GHz is achieved and fabricated. The measured results agree with the simulated results.