Open AccessThermal Characteristics of a Laser Diode Integrated on a Silica‐Terraced PLC Platform
Author(s) -
Kim DukJun,
Han YoungTak,
Park YoonJung,
Park SangHo,
Shin JangUk,
Sung HeeKyung
Publication year - 2005
Publication title -
etri journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.295
H-Index - 46
eISSN - 2233-7326
pISSN - 1225-6463
DOI - 10.4218/etrij.05.0205.0005
Subject(s) - materials science , diode , thermal management of electronic devices and systems , optoelectronics , dissipation , planar , laser diode , laser , thermal , terrace (agriculture) , chip , integrated circuit , composite material , optics , electrical engineering , mechanical engineering , engineering , computer science , history , physics , computer graphics (images) , archaeology , meteorology , thermodynamics
A spot‐size converted Fabry‐Perot laser diode (LD) was flip‐chip bonded to a silica‐terraced planar lightwave circuit (PLC) platform to examine the effect of the silica terrace on the heat dissipation of the LD module. From the measurement of the light‐current characteristics, it was discovered that the silica terrace itself is not a strong thermal barrier, but the encapsulation of the integrated LD with an index‐matching polymer resin more or less deteriorates the heat dissipation.