
Utilization of Passive Thermal Control Technologies for Electronics Cooling: A Brief Review
Author(s) -
Riehl Rr
Publication year - 2016
Publication title -
journal of applied mechanical engineering
Language(s) - English
Resource type - Journals
ISSN - 2168-9873
DOI - 10.4172/2168-9873.1000214
Subject(s) - thermal management of electronic devices and systems , electronics , computer science , work (physics) , emerging technologies , heat pipe , water cooling , systems engineering , mechanical engineering , aerospace engineering , environmental science , heat transfer , engineering , electrical engineering , physics , artificial intelligence , thermodynamics