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Sub-bottom profiler survey
Author(s) -
Michael Riedel,
J K Hong,
K W Conway,
D S Shin,
S Kim,
H J Kim,
Haklim Choi,
Y -G Kim,
N Seo,
M Ulmi,
H S Kim,
E J Byun,
YongJae Lee
Publication year - 2015
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.4095/295967
Subject(s) - top down and bottom up design , computer science , software engineering

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