Open AccessFabrication of Highly Reliable Joint Based on Cu/Ni/Sn Double-Layer Powder for High Temperature Application
Author(s) -
Hongyan Xu,
Yaochun Shen,
Yihua Hu,
Jianqiang Li,
Jiang Xu
Publication year - 2019
Publication title -
journal of microelectronics and electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.192
H-Index - 17
eISSN - 1555-8037
pISSN - 1551-4897
DOI - 10.4071/imaps.960671
Subject(s) - materials science , intermetallic , microstructure , soldering , layer (electronics) , composite material , coating , void (composites) , fabrication , joint (building) , shear strength (soil) , metallurgy , phase (matter) , metal , alloy , medicine , architectural engineering , chemistry , alternative medicine , environmental science , organic chemistry , pathology , soil science , engineering , soil water