Open AccessThin Film on LTCC for Connectivity and Conductivity
Author(s) -
J. Wolf,
K. A. Peterson
Publication year - 2011
Publication title -
journal of microelectronics and electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.192
H-Index - 17
eISSN - 1555-8037
pISSN - 1551-4897
DOI - 10.4071/imaps.288
Subject(s) - materials science , soldering , thin film , printed circuit board , ceramic , optoelectronics , rework , electrical conductor , electronic circuit , wave soldering , composite material , electronic engineering , electrical engineering , computer science , nanotechnology , engineering , embedded system
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