Open AccessThermal Cycling Test and Simulation of Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration
Author(s) -
John H. Lau,
Cheng-Ta Ko,
Chia-Yu Peng,
Kaiming Yang,
Tim Xia,
Puru Bruce Lin,
Jean-Jou Chen,
Po-Chun Huang,
Tzvy-Jang Tseng,
Eagle Lin,
Leo Chang,
Curry Lin,
Yan-Jun Fan,
Hsing-Ning Liu,
Winnie Lu
Publication year - 2021
Publication title -
journal of microelectronics and electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.192
H-Index - 17
eISSN - 1555-8037
pISSN - 1551-4897
DOI - 10.4071/imaps.1419800
Subject(s) - temperature cycling , weibull distribution , printed circuit board , soldering , reliability (semiconductor) , flip chip , integrated circuit , engineering , daisy chain , thermal , chip , structural engineering , materials science , reliability engineering , composite material , electrical engineering , layer (electronics) , mathematics , power (physics) , statistics , physics , adhesive , quantum mechanics , meteorology
In this study, the reliability of the solder joints of a heterogeneous integration of one large chip (10 × 10 mm) and two smaller chips (7 × 5 mm) by a fan-out method with a redistribution layer-first substrate fabricated on a 515 × 510-mm panel is investigated. Emphasis is placed on the thermal cycling test (−55°C Δ 125°C, 50-min cycle) of the heterogeneous integration package on a printed circuit board (PCB). The thermal cycling test results are plotted into a Weibull distribution. The Weibull slope and characteristic life at median rank are presented. At 90% confidence, the true Weibull slope and the true 10% life interval are also provided. A linear acceleration factor is adopted to map the solder joint reliability at the test condition to the solder joint reliability at an operating condition. The failure location and failure mode of the PCB assembly of the heterogeneous integration package are provided and discussed. A nonlinear, time- and temperature-dependent 3-D finite element simulation is performed for the heterogeneous integration PCB assembly and correlated with the thermal cycling test results.