Open AccessThe Effect of Cu Target Pad Roughness and Solution Flow on the Growth Mode and Void Formation in Electroless Cu Films
Author(s) -
Tobias Bernhard,
Sebastian Zarwell,
Roger Massey,
Edith Steinhäuser,
Stefan Kempa,
Frank Branduuml
Publication year - 2021
Publication title -
journal of microelectronics and electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.192
H-Index - 17
eISSN - 1555-8037
pISSN - 1551-4897
DOI - 10.4071/imaps.1409209
Subject(s) - void (composites) , surface finish , materials science , surface roughness , substrate (aquarium) , cyanide , interconnection , composite material , electroless deposition , copper , metallurgy , nanotechnology , chemical engineering , computer network , oceanography , computer science , engineering , geology