Open AccessImpact of Die Attach Sample Preparation on Its Measured Mechanical Properties for MEMS Sensor Applications
Author(s) -
Abel Misrak,
Tushar Chauhan,
Rabin Bhandari,
A S M Raufur Chowdhury,
Akshay Lakshminarayana,
Fahad Mirza,
B. Gholami Bazehhour,
Milena Vujosevic,
Dereje Agonafer
Publication year - 2021
Publication title -
journal of microelectronics and electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.192
H-Index - 17
eISSN - 1555-8037
pISSN - 1551-4897
DOI - 10.4071/imaps.1234982
Subject(s) - curing (chemistry) , materials science , microelectromechanical systems , die (integrated circuit) , material properties , mechanical engineering , characterization (materials science) , thermomechanical analysis , thermal expansion , elastomer , sample preparation , composite material , nanotechnology , engineering , chemistry , chromatography
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