Open AccessThin Film on LTCC for Connectivity and Conductivity
Author(s) -
J. Wolf,
K. Peterson
Publication year - 2011
Publication title -
additional conferences (device packaging hitec hiten and cicmt)
Language(s) - English
Resource type - Journals
ISSN - 2380-4491
DOI - 10.4071/cicmt-2011-tp35
Subject(s) - materials science , soldering , thin film , printed circuit board , optoelectronics , wave soldering , ceramic , electronic circuit , composite material , computer science , electrical engineering , nanotechnology , engineering , operating system
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