Open AccessFemtosecond laser processing – a new enabling technology
Author(s) -
Ričardas Buividas,
Mindaugas Mikutis,
Tadas Kudrius,
Artūras Greičius,
G. Šlekys,
Saulius Juodkazis
Publication year - 2012
Publication title -
lithuanian journal of physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.269
H-Index - 16
eISSN - 2424-3647
pISSN - 1648-8504
DOI - 10.3952/lithjphys.52402
Subject(s) - femtosecond , wafer dicing , laser , materials science , materials processing , laser cutting , laser drilling , laser ablation , dielectric , ripple , throughput , laser beam machining , computer science , optoelectronics , nanotechnology , process engineering , optics , laser beams , engineering , electrical engineering , telecommunications , physics , voltage , wafer , wireless
Recent results in high-precision surface ablation, film removal, ripple formation are presented. Volume processing via polymerization, marking, dicing, cutting, and drilling of semiconductor and dielectric materials are discussed. We focus on processes which can be carried out at a high throughput in the industrial environment or/and can deliver functionalities currently not amenable by competing technologies. Unique features of direct laser writing by femtosecond laser pulses are highlighted. Methodology for solutions of engineering tasks is presented. Namely, the laser irradiation parameters are selected on the basis of the required processing conditions for the material of a workpiece