Open AccessElectro-thermal modelling and Tj estimation of wire-bonded IGBT power module with multi-chip switches subject to wire-bond lift-off
Author(s) -
Nicolas Degrenne,
Romain Delamea,
Stefan Mollov
Publication year - 2020
Publication title -
aims electronics and electrical engineering
Language(s) - English
Resource type - Journals
ISSN - 2578-1588
DOI - 10.3934/electreng.2020.2.154
Subject(s) - insulated gate bipolar transistor , junction temperature , lift (data mining) , calibration , chip , compensation (psychology) , power cycling , wire bonding , power (physics) , materials science , power module , degradation (telecommunications) , thermal , electronic engineering , voltage , electrical engineering , computer science , engineering , reliability (semiconductor) , physics , quantum mechanics , meteorology , psychology , statistics , mathematics , psychoanalysis , data mining
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