Open AccessProperties of particleboard produced with liquefaction-modified phenol-formaldehyde adhesive
Author(s) -
Jung-Uk Lee,
YongSung Oh
Publication year - 2010
Publication title -
turkish journal of agriculture and forestry
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.624
H-Index - 43
eISSN - 1303-6173
pISSN - 1300-011X
DOI - 10.3906/tar-0905-30
Subject(s) - adhesive , phenol , sulfuric acid , formaldehyde , liquefaction , phenol formaldehyde resin , materials science , softwood , pinus densiflora , composite material , chemistry , nuclear chemistry , organic chemistry , metallurgy , botany , layer (electronics) , biology
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