Open AccessLow loaded Pt-Co catalyst surfaces optimized by magnetron sputtering sequential deposition technique for PEM fuel cell applications: physical and electrochemical analysis on carbon paper support
Author(s) -
Osman Öztürk,
Aydın Haşimoğlu,
Oğuz Kaan Özdemir,
İnci Karaaslan,
Ali Şems Ahsen
Publication year - 2021
Publication title -
turkish journal of chemistry
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.239
H-Index - 46
eISSN - 1303-6130
pISSN - 1300-0527
DOI - 10.3906/kim-2101-50
Subject(s) - linear sweep voltammetry , sputter deposition , cavity magnetron , chemistry , cyclic voltammetry , electrochemistry , thin film , analytical chemistry (journal) , proton exchange membrane fuel cell , rotating disk electrode , carbon fibers , electrode , deposition (geology) , chemical engineering , catalysis , sputtering , materials science , nanotechnology , composite material , organic chemistry , paleontology , sediment , composite number , engineering , biology
A series of thin Pt-Co films with different metal ratios were deposited by using the sequential cosputtering directly on a commercial hydrophobic carbon paper substrate at room temperature and in ultra-high vacuum (UHV) conditions. Their electrocatalytic properties toward the oxygen reduction reaction were investigated in 0.5 M H 2 SO 4 solution by means of cyclic voltammetry (CV) and linear sweep voltammetry (LSV) on rotating disc electrode (RDE). The results showed that Pt particles, deposited by dc-magnetron gun, surround the large Co-clusters deposited by rf-magnetron gun. In addition, the increase of Co content led to an increase in the electrochemical active surface area (EASA) from 23.75 m 2 /gPt to 47.54 m 2 /gPt for pure Pt and Pt:Co (1:3), respectively, which corresponded the improvement of the utilization of Pt by a factor of 1.91. This improvement indicated that the sequential magnetron cosputtering was one of the essential technique to deposit homogeneous metal clusters with desirable size on the gas diffusion layer by adjustment plasma parameters.