Open AccessStress-strain characteristics, dynamic recrystallization, grain growth, and melting point of the binary and ternary solder alloys
Author(s) -
SHAKIB MOQBEL ALI MOHAMMED ALSOWIDY,
MOHAMMED ALI SHUKRI
Publication year - 2011
Publication title -
turkish journal of physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.169
H-Index - 26
eISSN - 1303-6122
pISSN - 1300-0101
DOI - 10.3906/fiz-1101-89
Subject(s) - materials science , dynamic recrystallization , flow stress , differential scanning calorimetry , metallurgy , microstructure , work hardening , melting point , recrystallization (geology) , grain size , ternary operation , softening , alloy , hot working , composite material , thermodynamics , paleontology , physics , biology , computer science , programming language