Open AccessSimulation of SiP Solder Joint Geometry and Random Vibration Reliability Prediction
Author(s) -
校正后模型进行振动仿真 获得危险点应力数据,
结合试验所得的疲劳寿命数据拟合得到材料的 S-N,
振动仿真分析确定器件危险薄弱点 通过,
S Zicheng,
Shang Wang,
Jiayun Feng,
Jun Ma,
Ning Zhang,
Guang Yang,
Jing Liang,
Yanhong Tian
Publication year - 2022
Publication title -
jixie gongcheng xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.342
H-Index - 50
ISSN - 0577-6686
DOI - 10.3901/jme.2022.02.276
Subject(s) - reliability (semiconductor) , joint (building) , random vibration , vibration , soldering , structural engineering , computer science , geometry , materials science , engineering , mathematics , acoustics , composite material , physics , power (physics) , quantum mechanics