Open AccessEffect of Zn Content on Interfacial Reactions of Cu/Sn/Cu-xZn Micro Solder Joints
Author(s) -
zn 微焊点中冷端界面,
Imc 生长速率急剧减小,
Imc 随回流时间的生长规律,
分别获得了等温回流和温度梯度下回流时,
Cu Sn,
Cu-Xzn 微焊点两侧,
Imc 的生长动力学,
Zhibin Liu,
Yuanyuan Qiao,
Ning Zhao
Publication year - 2022
Publication title -
journal of mechanical engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.342
H-Index - 50
ISSN - 0577-6686
DOI - 10.3901/jme.2022.02.269
Subject(s) - soldering , metallurgy , materials science , copper , zinc
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