Open AccessSize Effects of Growth and Evolution of Interfacial Intermetallic Compound and the Mechanical Behavior of Bump Structure Sn3.0Ag0.5Cu/Cu Cross-scale Joints in Electronic Packages
Author(s) -
Min-Bo Zhou,
Zhao Xingfei,
Mingqiang Chen,
KE Changbo,
Xinping Zhang
Publication year - 2022
Publication title -
journal of mechanical engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.342
H-Index - 50
ISSN - 0577-6686
DOI - 10.3901/jme.2022.02.259
Subject(s) - intermetallic , materials science , scale (ratio) , composite material , metallurgy , physics , alloy , quantum mechanics
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