Open AccessStress Issues in 3D Interconnect Technology Using Through Glass Vias
Author(s) -
Junkai Zhao,
Wei Li,
Yi Zhong,
Daquan Yu,
Fei Qin
Publication year - 2022
Publication title -
jixie gongcheng xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.216
H-Index - 12
ISSN - 0577-6686
DOI - 10.3901/jme.2022.02.246
Subject(s) - interconnection , materials science , stress (linguistics) , engineering physics , optoelectronics , computer science , engineering , telecommunications , philosophy , linguistics