Open AccessResearch Progress on the Influence Mechanisms of βSn Structure and Grain Orientation on the Reliabilities of Solder Joints
Author(s) -
包括利用异质形核剂,
多晶及单晶 Co,
基板 磁场及温度梯度等多种调控方法,
本 文讨论了未来进一步提高焊锡接头可靠性的研究方向 。 最后,
Ce Li,
Wang Bingguang,
Chang Xufeng,
M Zhaolong,
Xingwang Cheng
Publication year - 2022
Publication title -
jixie gongcheng xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.342
H-Index - 50
ISSN - 0577-6686
DOI - 10.3901/jme.2022.02.203
Subject(s) - soldering , materials science , metallurgy , orientation (vector space) , geometry , mathematics