Open AccessPatterning Deposition of Nano-sliver Micro Bumps Array by Ultrafast Laser and Its Chip Packaging Research
Author(s) -
Yongchao Wu,
Shuaiqi Wang,
Wei Guo,
Lei Liu,
Zou Guisheng,
Peng Peng
Publication year - 2022
Publication title -
journal of mechanical engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.342
H-Index - 50
ISSN - 0577-6686
DOI - 10.3901/jme.2022.02.166
Subject(s) - chip , materials science , deposition (geology) , laser , nanotechnology , optoelectronics , ultrashort pulse , nano , engineering , optics , electrical engineering , composite material , physics , geology , paleontology , sediment
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