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Review of Power Ultrasonic Micro-nano Joining Technology for Electronic Manufacturing
Author(s) -
、 Al,
Wenwu Zhang,
Hao Pan,
Qiuchen Ma,
Mingyu Li,
并提出了固相连接 中的超声变形机制
Publication year - 2022
Publication title -
journal of mechanical engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.342
H-Index - 50
ISSN - 0577-6686
DOI - 10.3901/jme.2022.02.100
Subject(s) - nano , ultrasonic sensor , materials science , power (physics) , electronics , nanotechnology , electrical engineering , engineering , composite material , acoustics , physics , quantum mechanics

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