Open AccessEffects of Additives and Heat Treatment on the Electrical Properties of Cobalt Interconnect Plating
Author(s) -
Shuhui Chen,
Mengyun Zhang,
Linlin Tan,
Ming Li
Publication year - 2022
Publication title -
jixie gongcheng xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.342
H-Index - 50
ISSN - 0577-6686
DOI - 10.3901/jme.2022.02.066
Subject(s) - cobalt , interconnection , plating (geology) , materials science , metallurgy , computer science , telecommunications , physics , geophysics