Open AccessStudy on Ultrafine Wire Bonding and Performance of Radio Frequency Devices
Author(s) -
Shang Wang,
Kaifeng Wang,
He Zhang,
Jiahui Xu,
Dongsheng Yang,
Tian Chunjin
Publication year - 2021
Publication title -
journal of mechanical engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.342
H-Index - 50
ISSN - 0577-6686
DOI - 10.3901/jme.2021.22.201
Subject(s) - materials science , radio frequency , wire bonding , optoelectronics , telecommunications , engineering , chip
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