Open AccessResearch on Cutting Force Model of Diamond Wire Saw with Single Crystal Silicon Swing
Author(s) -
料摆辅助切片加工有助于减少硅片表面因脆性崩裂产生的表面材料破损,
、 深凹坑等缺陷;相较于普通切片加工,
在摆,
Yong Feng,
Xiaoyu Wang,
Zhenqin Xu,
J Fuhua,
Haoxiang Wang
Publication year - 2021
Publication title -
jixie gongcheng xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.216
H-Index - 12
ISSN - 0577-6686
DOI - 10.3901/jme.2021.19.024
Subject(s) - swing , diamond , silicon , materials science , crystal (programming language) , mechanical engineering , optoelectronics , composite material , engineering , computer science , programming language