Open AccessReliability in Electronic Packaging: Past, Now and Future
Author(s) -
Zhiwen Chen,
Mei Yunhui,
Sheng Liu,
Hui Li,
Liu Li,
Xiang Lei,
Ying Zhou,
Gao Xiang,
共晶温,
Sn-Cu 合金
Publication year - 2021
Publication title -
jixie gongcheng xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.342
H-Index - 50
ISSN - 0577-6686
DOI - 10.3901/jme.2021.16.248
Subject(s) - reliability (semiconductor) , reliability engineering , electronic packaging , computer science , engineering , electrical engineering , physics , power (physics) , quantum mechanics