Open AccessReliability in Electronic Packaging: Past, Now and Future
Author(s) -
Zhiwen Chen,
Mei Yunhui,
Sheng Liu,
Hui Li,
Li Liu,
Xiang Lei,
Zhou Ying,
Gao Xiang
Publication year - 2021
Publication title -
journal of mechanical engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.342
H-Index - 50
ISSN - 0577-6686
DOI - 10.3901/jme.2021.16.248
Subject(s) - reliability (semiconductor) , reliability engineering , electronic packaging , computer science , engineering , electrical engineering , physics , power (physics) , quantum mechanics
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom