Open AccessScreen Printing Conductive Ink Transfer Mechanism and Simulation Research
Author(s) -
S. B. Liu,
Yan Li,
Ye Tian,
Yuan Yingcai
Publication year - 2021
Publication title -
journal of mechanical engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.342
H-Index - 50
ISSN - 0577-6686
DOI - 10.3901/jme.2021.05.231
Subject(s) - inkwell , mechanism (biology) , electrical conductor , transfer printing , materials science , conductive ink , nanotechnology , computer science , composite material , physics , quantum mechanics , sheet resistance , layer (electronics)
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