Method for Simultaneously Sensing the Internal Temperature Field and Thickness of Solid Structure under Steady Heat Conduction Condition
Author(s) -
Bin Hu,
Wei Dong,
Youan Shi,
Binan Shou,
Gui Yewei
Publication year - 2021
Publication title -
journal of mechanical engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.216
H-Index - 12
ISSN - 0577-6686
DOI - 10.3901/jme.2021.04.021
Subject(s) - thermal conduction , internal heating , materials science , field (mathematics) , mechanics , condensed matter physics , composite material , physics , mathematics , pure mathematics
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom