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Rapid Sintering of Nano Copper-Silver Core-Shell Paste and Interconnection of Copper Substrates by Pulse Current
Author(s) -
Huang Yuan,
Hang Chun-jin,
Yanhong Tian,
Chenxi Wang,
He Zhang
Publication year - 2019
Publication title -
journal of mechanical engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.342
H-Index - 50
ISSN - 0577-6686
DOI - 10.3901/jme.2019.24.051
Subject(s) - copper , sintering , interconnection , materials science , shell (structure) , nano , core (optical fiber) , metallurgy , current (fluid) , pulse (music) , composite material , electrical engineering , engineering , telecommunications , detector

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