Open AccessInfluence of the Hybrid BGA Residual Stress after Reflow on the Thermal Cycling Reliability
Author(s) -
Yanhong Tian
Publication year - 2014
Publication title -
jixie gongcheng xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.342
H-Index - 50
ISSN - 0577-6686
DOI - 10.3901/jme.2014.02.086
Subject(s) - temperature cycling , reliability (semiconductor) , ball grid array , residual stress , cycling , reliability engineering , materials science , stress (linguistics) , soldering , thermal , composite material , engineering , thermodynamics , history , power (physics) , physics , linguistics , philosophy , archaeology