z-logo
open-access-imgOpen Access
Effect of Additives on Electroless Deposition Rate
Author(s) -
GH Hu,
HH Wu,
FZ Yang,
Wang S-L,
杨防祖
Publication year - 2004
Publication title -
wuli huaxue xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.396
H-Index - 37
ISSN - 1000-6818
DOI - 10.3866/pku.whxb20040323
Subject(s) - deposition (geology) , chemical engineering , electroless deposition , materials science , metallurgy , geology , engineering , copper , paleontology , sediment

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here