Open AccessEffect of Additives on Electroless Deposition Rate
Author(s) -
Guanghui Hu,
Huihuang Wu,
Yang FangZu,
Senlin Wang
Publication year - 2004
Publication title -
acta physico-chimica sinica
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.396
H-Index - 37
ISSN - 1000-6818
DOI - 10.3866/pku.whxb20040323
Subject(s) - deposition (geology) , chemical engineering , electroless deposition , materials science , metallurgy , geology , engineering , copper , paleontology , sediment
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