
<i>In situ</i> Investigation on the Behavior of Mixed Potential in Electroless Copper Plating
Author(s) -
Chi-Lun Lin,
GH Hu,
ZC Wang,
Xiaohong Gu,
王周成
Publication year - 2004
Publication title -
wuli huaxue xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.396
H-Index - 37
ISSN - 1000-6818
DOI - 10.3866/pku.whxb20040201
Subject(s) - copper , in situ , copper plating , metallurgy , plating (geology) , materials science , chemistry , nanotechnology , biology , electroplating , organic chemistry , layer (electronics) , paleontology