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Feasibility study of micromachining of silicon wafer with excimer laser using COMSOL multiphysics
Author(s) -
Gaganpreet Singh,
Shashank Sharma,
Kritika Singh,
J. Ramkumar
Publication year - 2016
Language(s) - English
Resource type - Conference proceedings
DOI - 10.3850/978-981-09-7519-7nbl16-rps-237
Subject(s) - multiphysics , surface micromachining , excimer laser , wafer , materials science , silicon , optoelectronics , laser beam machining , laser , microelectromechanical systems , optics , laser beams , finite element method , engineering , fabrication , physics , medicine , alternative medicine , structural engineering , pathology

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