Open AccessImproved Thermal Resistance of an LED Package Interfaced with an Epoxy Composite of Diamond Powder Suspended in H2O2
Author(s) -
최봉만,
홍성훈,
정용범,
김기보,
Seung Gol Lee,
Park Se Geun,
O BeomHoan
Publication year - 2014
Publication title -
han-guk gwanghak hoeji/han'gug gwanghag hoeji
Language(s) - English
Resource type - Journals
eISSN - 2287-321X
pISSN - 1225-6285
DOI - 10.3807/kjop.2014.25.4.221
Subject(s) - diamond , epoxy , materials science , thermal resistance , composite material , hydrogen peroxide , composite number , thermal , filler (materials) , chemistry , physics , organic chemistry , meteorology