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Numerical Study on Heat Propagation in Laptop Cooling System
Author(s) -
Wong Mian Sheng,
Abdulhafid M. Elfaghi,
Lukmon Owolabi Afolabi
Publication year - 2022
Publication title -
journal of advanced research in fluid mechanics and thermal sciences
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.247
H-Index - 13
ISSN - 2289-7879
DOI - 10.37934/arfmts.99.1.5865
Subject(s) - microelectronics , heat sink , computational fluid dynamics , fluent , mechanical engineering , computer simulation , passive cooling , transient (computer programming) , thermal conductivity , laptop , thermal , work (physics) , heat transfer , nuclear engineering , computer science , mechanics , engineering , materials science , simulation , aerospace engineering , electrical engineering , thermodynamics , physics , composite material , operating system

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